General Information
    • ISSN: 2010-0221
    • Frequency: Bimonthly
    • DOI: 10.18178/IJCEA
    • Editor-in-Chief: Prof. Dr. Shen-Ming Chen
    • Executive Editor: Mr. Ron C. Wu
    • Abstracting/ Indexing: Chemical Abstracts Services (CAS), Ulrich's Periodicals Directory, CABI, Electronic Journals Library, Google Scholar, ProQuest, and Crossref
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Editor-in-chief
Prof. Dr. Shen-Ming Chen
National Taipei University of Technology, Taiwan
 

IJCEA 2012 Vol.3(3): 195-200 ISSN: 2010-0221
DOI: 10.7763/IJCEA.2012.V3.185

Application of Network Representation Model for Radiation Analysis

Ummi Kalthum Ibrahim and Ruzitah Mohd Salleh
Abstract—In an oven, the hot air flows by natural or forced convection while heat is distributed from the heating element by radiation. During baking process, heat is also transfer by conduction from the baking metal container to the baked product. Radiation is considered as the main process of heat transfer occurred in the oven. Use of network representation method provides a useful tool for visualizing radiation exchange. However, not many papers have been published in using this technique. Due to that, this paper presents the development of network representation method for calculating the radiation behavior and observing the temperature profiles in the oven during baking process. The network is built based on identifying nodes associated with radiosities of each surfaces in the oven. Two types of oven were used to identify the radiation effect. The results show high emissivity oven (black surface) gives more radiation energy compared to low emissivity oven (shiny surface).

Index Terms—Baking, network representation method, oven, radiation heat transfer.

The authors are with faculty of Chemical Engineering, Universiti Teknologi MARA (UiTM), 40450 Shah Alam, Selangor, Malaysia (e-mail: ummi985@salam.uitm.edu.my).

[PDF]


Cite: Ummi Kalthum Ibrahim and Ruzitah Mohd Salleh, "Application of Network Representation Model for Radiation Analysis," International Journal of Chemical Engineering and Applications vol. 3, no. 3, pp. 195-200, 2012.
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